FAS1300 高精度贴片机
FAS 1300 High-Precision Die Bonder
异形器件贴装 | Odd component Compatibility
多种点胶方式 | Multiple Dispensing Methods
实时微力控制 | Real-time Micro-Force Control
在线UV固化 | In-line UV Curing System
高精度运动控制 | High-precision Motion
先进视觉系统 | Advanced Vision
有效优化空间 | Small Footprint
设备参数 Specification | |
参数名称 | 参数值 |
X/Y placement accuracy | ±10μm@3σ |
Theta placement accuracy | ±0.5°@3σ |
Bond Force1 | 20g~50g ≤±2g |
Bond Force 2 | 50g~400g ≤±3g |
Footprint (L*W*H) | 990mm*1057mm*1962mm |
Component Trays 1 | Waffle pack/Gel-Pak 2"x2" |
Component Trays 2 | Gel-Pak 4"x4" |
Bond-Head Theta Rotation | ±180° |
FAS1300 高精度贴片机
FAS 1300 High-Precision Die Bonder
异形器件贴装 | Odd component Compatibility
多种点胶方式 | Multiple Dispensing Methods
实时微力控制 | Real-time Micro-Force Control
在线UV固化 | In-line UV Curing System
高精度运动控制 | High-precision Motion
先进视觉系统 | Advanced Vision
有效优化空间 | Small Footprint
设备参数 Specification | |
参数名称 | 参数值 |
X/Y placement accuracy | ±10μm@3σ |
Theta placement accuracy | ±0.5°@3σ |
Bond Force1 | 20g~50g ≤±2g |
Bond Force 2 | 50g~400g ≤±3g |
Footprint (L*W*H) | 990mm*1057mm*1962mm |
Component Trays 1 | Waffle pack/Gel-Pak 2"x2" |
Component Trays 2 | Gel-Pak 4"x4" |
Bond-Head Theta Rotation | ±180° |
